Chip AI consultant
Technical parameters/power supply voltage (DC): | 48.0 V |
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Technical parameters/rated power: | 66 W |
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Technical parameters/number of output interfaces: | 2 |
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Technical parameters/Input voltage (DC): | 36.0V ~ 75.0V |
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Technical parameters/output voltage: | ±15 V |
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Technical parameters/output current: | 2.2 A |
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Technical parameters/adjusted output: | 2 |
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Technical parameters/output power: | 66 W |
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Technical parameters/isolation voltage: | 1.5 kV |
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Technical parameters/topology structure: | Buck |
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Technical parameters/Input voltage (Max): | 75 V |
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Technical parameters/input voltage (Min): | 36 V |
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Technical parameters/output current (Max): | 2.2A, 2.2A |
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Technical parameters/rated power (Max): | 66 W |
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Technical parameters/operating temperature (Max): | 85 ℃ |
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Technical parameters/operating temperature (Min): | -40 ℃ |
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Technical parameters/input voltage: | 48 V |
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Encapsulation parameters/installation method: | Surface Mount |
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Package parameters/number of pins: | 8 |
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Encapsulation parameters/Encapsulation: | SMD-8 |
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Dimensions/Length: | 56.4 mm |
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Dimensions/Width: | 36.8 mm |
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Dimensions/Height: | 13.3 mm |
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Dimensions/Packaging: | SMD-8 |
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Physical parameters/operating temperature: | -40℃ ~ 85℃ |
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Other/Product Lifecycle: | Not Recommended for New Designs |
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Other/Packaging Methods: | Tray |
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Other/Manufacturing Applications: | ITE（Business) |
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Compliant with standards/RoHS standards: | Non-Compliant |
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Compliant with standards/lead standards: |
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual |
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