Encapsulation parameters/installation method: | Surface Mount |
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Encapsulation parameters/Encapsulation: | H-37275-6 |
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Dimensions/Packaging: | H-37275-6 |
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Physical parameters/operating temperature: | -65℃ ~ 200℃ |
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Other/Product Lifecycle: | Not Recommended for New Designs |
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Other/Packaging Methods: | Tape & Reel (TR) |
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Compliant with standards/RoHS standards: | RoHS Compliant |
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Compliant with standards/lead standards: | Lead Free |
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| Model | Brand | Similarity | Encapsulation | Introduction | Data manual |
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