Chip AI consultant
Technical parameters/output current: | ≤20.0 mA |
| ||||||
Technical parameters/number of channels: | 1 |
| ||||||
Technical parameters/number of pins: | 2 |
| ||||||
Technical parameters/wavelength: | 800 nm |
| ||||||
Technical parameters/perspective: | 35° |
| ||||||
Technical parameters/peak wavelength: | 800 nm |
| ||||||
Technical parameters/polarity: | NPN |
| ||||||
Technical parameters/dissipated power: | 75.0 mW |
| ||||||
Technical parameters/power consumption: | 75 mW |
| ||||||
Technical parameters/rise time: | 3000 ns |
| ||||||
Technical parameters/breakdown voltage (collector emitter): | 35 V |
| ||||||
Technical parameters/rated power (Max): | 75 mW |
| ||||||
Technical parameters/descent time: | 3500 ns |
| ||||||
Technical parameters/descent time (Max): | 3500 ns |
| ||||||
Technical parameters/rise time (Max): | 3000 ns |
| ||||||
Technical parameters/operating temperature (Max): | 85 ℃ |
| ||||||
Technical parameters/operating temperature (Min): | -25 ℃ |
| ||||||
Technical parameters/dissipated power (Max): | 75 mW |
| ||||||
Encapsulation parameters/installation method: | Through Hole |
| ||||||
Package parameters/number of pins: | 2 |
| ||||||
Encapsulation parameters/Encapsulation: | Side Looking |
| ||||||
Dimensions/Length: | 3 mm |
| ||||||
Dimensions/Width: | 1.5 mm |
| ||||||
Dimensions/Height: | 3.5 mm |
| ||||||
Dimensions/Foot Length: | 17.5 mm |
| ||||||
Dimensions/Packaging: | Side Looking |
| ||||||
Physical parameters/operating temperature: | -25℃ ~ 85℃ (TA) |
| ||||||
Other/Product Lifecycle: | Active |
| ||||||
Other/Packaging Methods: | Each |
| ||||||
Other/Manufacturing Applications: | Consumer Electronics, Consumer Electronics, Communications a Alternative material
Newly listed productsVideo playback©Copyright 2013-2025 ICGOODFIND (Shenzhen) Electronics Technology Co., Ltd. |
The most helpful review