Technical parameters/resistance: | 10.0 Ω |
|
Encapsulation parameters/installation method: | Through Hole |
|
Encapsulation parameters/Encapsulation: | Non-Standard |
|
Dimensions/Length: | 10.0 mm |
|
Dimensions/Width: | 2.40 mm |
|
Dimensions/Packaging: | Non-Standard |
|
Dimensions/Thickness: | 1.40 mm |
|
Other/Packaging Methods: | Bulk |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual |
|---|
©Copyright 2013-2025 ICGOODFIND (Shenzhen) Electronics Technology Co., Ltd.
The most helpful review