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Model R7S910016CBG#AC0
Description RZ/T1 32 位微处理器 Renesas RZ/T1 设备是 RZ 系列嵌入式处理器中的 32 位微处理器。 具有 600 MHz ARM Cortex-R4 内核，可实时处理。 RZ/T1 微处理器的高速和响应率适用于工业应用。 ### 微处理器功能 32 位 ARM Cortex R4F 内核 最大操作 600 MHz 最大操作 996 DMIPS 哈佛体系结构，带 8 阶段管道 浮点单元 (FPU) ARM CoreSight 体系结构 直接内存访问控制器 (DMAC) 事件链接控制器 (ELC) 灵活的时钟选项 独立监控计时器 (IWDT) 外部地址空间 多功能引脚控制器 (MPC) JTAG 和 SWD 调试接口 存储器保护装置 (MPU) 支持 ### 低功耗功能 3 种低功率模式 – 待机、睡眠和模块停止 ### 外围功能 12 位模拟到数字转换器 (ADC) – 24 通道 扩展功能计时器 – 33 通道 温度传感器 ### 通信功能 EtherMAC – 1 端口 EtherCAT 从属控制器 USB 2.0 主机接口 – 1 通道 CAN 接口 – 2 通道 SCIFA，带 FIFO – 5 通道 RSPIa 接口 – 4 通道 I²C 接口 – 2 通道 SPIBSC 接口 – 1 通道 串行外设接口 (SPI) – 4 通道 四路串行外设接口 (QSPI) – 1 通道 ∆Σ 接口 ### RZ 嵌入式微处理器，Renesas Electronics RZ 系列微处理器将 Renesas 技术与 ARM® 生态系统结合。 微处理器经开发，可提供人机接口和云技术所需的高性能和节能解决方案。
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Brand: Renesas Electronics
Packaging FBGA
Delivery time
Packaging method
Standard packaging quantity 1
191.36  yuan 191.36yuan
  • Freight charges：   In stock Freight rate：$13.00
  • Quantity： Inventory(8604) Minimum order quantity(1)
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Technical parameters/RAM size:

1568 kB

 

Technical parameters/Analog to Digital Conversion (ADC):

1

 

Technical parameters/operating temperature (Max):

125 ℃

 

Technical parameters/operating temperature (Min):

-40 ℃

 

Encapsulation parameters/installation method:

Surface Mount

 

Package parameters/number of pins:

320

 

Encapsulation parameters/Encapsulation:

FBGA

 

Dimensions/Length:

17.2 mm

 

Dimensions/Width:

1.85 mm

 

Dimensions/Height:

17.2 mm

 

Dimensions/Packaging:

FBGA

 

Physical parameters/operating temperature:

-40℃ ~ 125℃

 

Other/Product Lifecycle:

Unknown

 

Compliant with standards/RoHS standards:

 

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