Encapsulation parameters/Encapsulation: | DIP |
|
Dimensions/Packaging: | DIP |
|
Other/Product Lifecycle: | Obsolete |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
AMD | 功能相似 | DIP |
OTP ROM, 1KX8, 80ns, Bipolar, CDIP24, 0.300 INCH, CERAMIC, DIP-24
|
||
M38510/20904BJA
|
E2V | 功能相似 | DIP |
OTP ROM, 1KX8, 90ns, Bipolar, 0.5 X 0.75INCH, DIP-24
|
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