Chip AI consultant
Technical parameters/capacitance: | 24 pF |
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Technical parameters/number of circuits: | 3 |
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Technical parameters/number of pins: | 8 |
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Technical parameters/holding current: | 30 mA |
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Technical parameters/Holding current (Max): | 30 mA |
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Technical parameters/operating temperature (Max): | 150 ℃ |
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Technical parameters/operating temperature (Min): | -40 ℃ |
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Encapsulation parameters/installation method: | Surface Mount |
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Package parameters/number of pins: | 8 |
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Encapsulation parameters/Encapsulation: | SOIC-8 |
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Dimensions/Packaging: | SOIC-8 |
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Physical parameters/operating temperature: | -40℃ ~ 150℃ |
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Other/Product Lifecycle: | Active |
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Other/Packaging Methods: | Tape & Reel (TR) |
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Compliant with standards/RoHS standards: | RoHS Compliant |
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Compliant with standards/lead standards: | Lead Free |
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Compliant with the REACH SVHC standard: | No SVHC |
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Compliant with standard/REACH SVHC version: | 2016/06/20 |
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Customs information/ECCN code: | EAR99 |
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| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
TISP7015DR-S
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Bourns J.W. Miller | 类似代替 | SOIC-8 |
三端电压非常低（ VLV ）保护 Three Terminal Very Low Voltage (VLV) Protection
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Bourns J.W. Miller | 功能相似 | SOP-8 |
TRIPLE元晶闸管过电压保护 TRIPLE ELEMENT THYRISTOR OVERVOLTAGE PROTECTORS
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