Encapsulation parameters/installation method: | Surface Mount |
|
Package parameters/number of pins: | 8 |
|
Encapsulation parameters/Encapsulation: | SOIC |
|
Dimensions/Packaging: | SOIC |
|
Other/Product Lifecycle: | Active |
|
Compliant with standards/RoHS standards: |
| |
Compliant with standards/lead standards: | Lead Free |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
REF02BU
|
Burr Brown | 完全替代 | SOIC-8 |
TEXAS INSTRUMENTS REF02BU 芯片, 串联电压基准, 5V, 10mV, 8-SOIC
|
||
REF02BU
|
TI | 完全替代 | SOIC-8 |
TEXAS INSTRUMENTS REF02BU 芯片, 串联电压基准, 5V, 10mV, 8-SOIC
|
||
REF02BUG4
|
TI | 完全替代 | SOIC-8 |
5V精密电压基准 5V Precision VOLTAGE REFERENCE
|
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