Technical parameters/number of circuits: | 1 |
|
Technical parameters/resistance: | 10.0 kΩ |
|
Technical parameters/resistance deviation: | ±20 % |
|
Encapsulation parameters/installation method: | Surface Mount |
|
Package parameters/number of pins: | 8 |
|
Encapsulation parameters/Encapsulation: | SOIC |
|
Dimensions/Packaging: | SOIC |
|
Physical parameters/temperature coefficient: | ±300 ppm/℃ |
|
Other/Product Lifecycle: | Obsolete |
|
Other/Packaging Methods: | Bulk |
|
Compliant with standards/RoHS standards: | Non-Compliant |
|
Compliant with standards/lead standards: | Contains Lead |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
X9313WS-3
|
Xicor | 完全替代 | SOIC |
线性, 32个抽头, 3线接口,端子电压的± VCC Linear, 32 Taps, 3 Wire Interface, Terminal Voltages ± VCC
|
||
X9313WS-3
|
Intersil | 完全替代 | SOIC-8 |
线性, 32个抽头, 3线接口,端子电压的± VCC Linear, 32 Taps, 3 Wire Interface, Terminal Voltages ± VCC
|
||
X9313WSZ-3
|
Renesas Electronics | 完全替代 | SOIC-8 |
线性, 32个抽头, 3线接口,端子电压的± VCC Linear, 32 Taps, 3 Wire Interface, Terminal Voltages ± VCC
|
©Copyright 2013-2025 ICGOODFIND (Shenzhen) Electronics Technology Co., Ltd.
The most helpful review