Technical parameters/number of pins: | 324 |
|
Technical parameters/RAM size: | 119808 B |
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Technical parameters/number of inputs/outputs: | 226 Input |
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Technical parameters/operating temperature (Max): | 100 ℃ |
|
Technical parameters/operating temperature (Min): | -40 ℃ |
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Technical parameters/power supply voltage: | 1.14V ~ 1.26V |
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Encapsulation parameters/installation method: | Surface Mount |
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Package parameters/number of pins: | 324 |
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Encapsulation parameters/Encapsulation: | CSBGA-324 |
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Dimensions/Packaging: | CSBGA-324 |
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Physical parameters/operating temperature: | -40℃ ~ 100℃ |
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Other/Product Lifecycle: | Active |
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Other/Packaging Methods: | Each |
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Compliant with standards/RoHS standards: | RoHS Compliant |
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Compliant with standards/lead standards: | Lead Free |
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Compliant with the REACH SVHC standard: | No SVHC |
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Compliant with standard/REACH SVHC version: | 2014/06/16 |
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Customs Information/Hong Kong Import and Export License: | NLR |
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| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
XC6SLX25-2CSG324C
|
Xilinx | 完全替代 | LFBGA-324 |
FPGA, Spartan-6, DCM, PLL, 226 I/O, 375 MHz, 24051单元, 1.14 V至1.26 V, CSBGA-324
|
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