Technical parameters/RAM size: | 768 b |
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Technical parameters/Analog to Digital Conversion (ADC): | 1 |
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Technical parameters/operating temperature (Max): | 150 ℃ |
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Technical parameters/operating temperature (Min): | -40 ℃ |
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Package parameters/number of pins: | 38 |
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Encapsulation parameters/Encapsulation: | TSSOP-38-4 |
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Dimensions/Packaging: | TSSOP-38-4 |
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Physical parameters/operating temperature: | -40℃ ~ 150℃ |
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Other/Product Lifecycle: | Active |
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Other/Packaging Methods: | Tape & Reel (TR) |
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Other/Manufacturing Applications: | keil, hitex, logo_smh_120, hilo-logo, zhiyuan_logo, Phyton Inc., Keil_logo_new, altium, xeltek, elnec, algocraft-Logo, iar, port_logo, Lauterbach, Dave_Bench, euros, bpm_microsystems |
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Compliant with standards/RoHS standards: | RoHS Compliant |
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Compliant with standards/lead standards: | lead-free |
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| Model | Brand | Similarity | Encapsulation | Introduction | Data manual |
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