Technical parameters/RAM size: | 512 b |
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Technical parameters/Analog to Digital Conversion (ADC): | 1 |
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Technical parameters/operating temperature (Max): | 85 ℃ |
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Technical parameters/operating temperature (Min): | -40 ℃ |
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Encapsulation parameters/installation method: | Surface Mount |
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Package parameters/number of pins: | 16 |
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Encapsulation parameters/Encapsulation: | TSSOP-16 |
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Dimensions/Packaging: | TSSOP-16 |
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Physical parameters/operating temperature: | -40℃ ~ 85℃ |
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Other/Product Lifecycle: | Active |
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Other/Packaging Methods: | Tape & Reel (TR) |
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Other/Manufacturing Applications: | iar, zhiyuan_logo, hitex, Keil_logo_new, euros, bpm_microsystems, xeltek, elnec, logo_smh_120, port_logo, altium, Dave_Bench, algocraft-Logo, Lauterbach, keil, Phyton Inc., hilo-logo |
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Compliant with standards/RoHS standards: | RoHS Compliant |
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Compliant with standards/lead standards: | lead-free |
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Customs information/ECCN code: | 3A991A2 |
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| Model | Brand | Similarity | Encapsulation | Introduction | Data manual |
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