Chip AI consultant
Encapsulation parameters/Encapsulation: | SOIC-14 |
|
Dimensions/Packaging: | SOIC-14 |
|
Other/Data Rate: | 20 Mbps |
|
Other/능: | Full Duplex |
|
Other/입력압: | 18 V |
|
Other/작동온도범위: | 40 C to + 85 C |
|
Other/출력류: | 250 mA |
|
Other/출력압: | 18 V |
|
Other/Case/Package: | SOIC-14N |
|
Other/Packaging: | Reel |
|
Other/Delete: | RS-422/RS-485 Combination |
|
Other/Propagation Delay Time ns: | 30 ns |
|
Other/공급류: | 600 uA |
|
Other/동착동동: | SMD/SMT |
|
Other/Number of I/Os: | 1 |
|
Other/Shutdown: | Yes |
|
Other/Delete 동업체: | Exar |
|
Other/Number of Drivers: | 1 |
|
Other/Number of Recipients: | 1 |
|
Other/작동공급압: | 4.5 V to 5.5 V |
|
Other/RoHS: | Compliant |
|
Compliant with standards/RoHS standards: | RoHS Compliant |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual |
|---|
©Copyright 2013-2025 ICGOODFIND (Shenzhen) Electronics Technology Co., Ltd.
The most helpful review