Technical parameters/power supply current: | 725 mA |
|
Technical parameters/number of circuits: | 6 |
|
Technical parameters/power supply voltage: | 3.135V ~ 3.465V |
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Encapsulation parameters/installation method: | Surface Mount |
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Package parameters/number of pins: | 217 |
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Encapsulation parameters/Encapsulation: | BBGA-217 |
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Dimensions/Packaging: | BBGA-217 |
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Physical parameters/operating temperature: | -40℃ ~ 85℃ |
|
Other/Packaging Methods: | Tray |
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Compliant with standards/RoHS standards: | RoHS Compliant |
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Compliant with standards/lead standards: | Lead Free |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
Maxlinear | 功能相似 | BBGA-217 |
电信接口IC
|
||
|
|
Exar Corporation | 功能相似 | BBGA-217 |
电信接口IC
|
||
|
|
Maxlinear | 功能相似 | BBGA-217 |
电信接口IC
|
||
|
|
Exar Corporation | 功能相似 | BBGA-217 |
电信接口IC
|
||
|
|
Exar Corporation | 完全替代 | BBGA-217 |
Line Interface Unit 51.84Mbps DS3/E3/STS-1 Parallel 217Pin BGA
|
||
|
|
Maxlinear | 完全替代 | PBGA-217 |
Line Interface Unit 51.84Mbps DS3/E3/STS-1 Parallel 217Pin BGA
|
||
|
|
Maxlinear | 完全替代 | PBGA-217 |
Line Interface Unit 51.84Mbps DS3/E3/STS-1 Parallel 217Pin BGA
|
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