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Model XWL1835MODGAMOCT
Description WLAN+BTCombo Module Chip IEEE 802.11B/g/n Bluetooth v4.0(BLE) + EDR 100Pin SIP SMD Module
Product QR code
Brand: TI
Packaging FLGA-130
Delivery time
Packaging method Cut Tape (CT)
Standard packaging quantity 1
130.34  yuan 130.34yuan
  • Freight charges：   In stock Freight rate：$13.00
  • Quantity： Inventory(2773) Minimum order quantity(1)
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Technical parameters/frequency:

2.4 GHz

 

Technical parameters/output power:

17.3 dBm

 

Technical parameters/power supply voltage:

2.9V ~ 4.8V

 

Encapsulation parameters/installation method:

Surface Mount

 

Package parameters/number of pins:

130

 

Encapsulation parameters/Encapsulation:

FLGA-130

 

Dimensions/Packaging:

FLGA-130

 

Physical parameters/operating temperature:

-20℃ ~ 70℃

 

Other/Product Lifecycle:

Active

 

Other/Packaging Methods:

Cut Tape (CT)

 

Compliant with standards/RoHS standards:

RoHS Compliant

 

Compliant with standards/lead standards:

Lead Free

 

Compliant with standard/REACH SVHC version:

2015/06/15

 

Customs Information/Hong Kong Import and Export License:

NLR

 

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Alternative material

Model Brand Similarity Encapsulation Introduction Data manual
WL1835MODGBMOCT WL1835MODGBMOCT TI 类似代替 SIP
TEXAS INSTRUMENTS WL1835MODGBMOCT 无线模块, 带蓝牙, IEEE802.11A/B/G/N
WL1835MODGBMOCT WL1835MODGBMOCT TI 类似代替 SIP
TEXAS INSTRUMENTS WL1835MODGBMOCT 无线模块, 带蓝牙, IEEE802.11A/B/G/N

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