Encapsulation parameters/Encapsulation: | SMD |
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Dimensions/Packaging: | SMD |
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Other/Max Processing Temps: | 230 to 260|260 °C |
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Other/Military Standards: | MIL-PRF-55182 |
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Other/Type: | Metal Foil |
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Other/Package Types: | SMD |
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Other/Product Dimensions: | mm |
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Other/Lead Finish: | Tin |
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Other/ECCN: | EAR99 |
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| Model | Brand | Similarity | Encapsulation | Introduction | Data manual |
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