Encapsulation parameters/installation method: | Surface Mount |
|
Encapsulation parameters/Encapsulation (metric): | 2012 |
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Encapsulation parameters/Encapsulation: | 0805 |
|
Dimensions/Length: | 2 mm |
|
Dimensions/Width: | 1.25 mm |
|
Dimensions/Packaging (Metric): | 2012 |
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Dimensions/Packaging: | 0805 |
|
Other/Product Lifecycle: | Active |
|
Other/Packaging Methods: | Tape & Reel (TR) |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
Vishay Precision Group | 功能相似 | 0805 |
RESISTOR, METAL FOIL, 0.2 W, 0.02 %, 0.2 ppm, 100 ohm, SURFACE MOUNT, 0805, CHIP
|
||
|
|
Vishay Semiconductor | 功能相似 |
RESISTOR, METAL FOIL, 0.2 W, 0.02 %, 0.2 ppm, 100 ohm, SURFACE MOUNT, 0805, CHIP
|
|||
Y1624100R000Q0W
|
Vishay Foil Resistors | 功能相似 | 0805(2012 公制) |
Res SMD 100Ω 0.02% 1/5W 0805
|
||
Y1624100R000Q9R
|
Vishay Dale | 功能相似 |
Res Metal Foil 0805 100Ω 0.02% 1/5W ±0.2ppm/℃ Molded SMD T/R
|
|||
|
|
Vishay Precision Group | 功能相似 | 0805 |
Res Metal Foil 0805 100Ω 0.02% 1/5W ±0.2ppm/℃ Molded SMD T/R
|
||
Y1624100R000Q9R
|
VISHAY | 功能相似 | 0805 |
Res Metal Foil 0805 100Ω 0.02% 1/5W ±0.2ppm/℃ Molded SMD T/R
|
||
Y1624100R000Q9R
|
Vishay Foil Resistors | 功能相似 | 0805 |
Res Metal Foil 0805 100Ω 0.02% 1/5W ±0.2ppm/℃ Molded SMD T/R
|
||
Y1624100R000Q9R
|
Vishay Semiconductor | 功能相似 | 0805 |
Res Metal Foil 0805 100Ω 0.02% 1/5W ±0.2ppm/℃ Molded SMD T/R
|
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