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Home Page   Classification of electronic components   active device   interface chip   ZL50111GAG
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Model ZL50111GAG
Description IC CESOP PROC 1024CH 552PBGA
Product QR code
Brand: Microsemi
Packaging BGA-552
Delivery time
Packaging method Tray
Standard packaging quantity 1
0yuan
  • Freight charges：   In stock Freight rate：$13.00
  • Quantity： Inventory(3795) Minimum order quantity(1)
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Encapsulation parameters/installation method:

Surface Mount

 

Encapsulation parameters/Encapsulation:

BGA-552

 

Dimensions/Packaging:

BGA-552

 

Other/Product Lifecycle:

Obsolete

 

Other/Packaging Methods:

Tray

 

Compliant with standards/RoHS standards:

Non-Compliant

 

Compliant with standards/lead standards:

Contains Lead

 

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Alternative material

Model Brand Similarity Encapsulation Introduction Data manual
ZL50111GAG2 ZL50111GAG2 Microchip 功能相似 BGA-552
CESoP Processor 1Gbps 1.8V 552Pin PBGA Tray

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