Chip AI consultant
Encapsulation parameters/installation method: | Surface Mount |
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Package parameters/number of pins: | 2011 |
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Other/EU RoHS: | Compliant |
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Other/Family Name: | Xeon® Processor E5-2630L v3 |
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Other/Structure Set Architecture: | RISC |
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Other/Device Core: | Xeon |
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Other/Number of CPU Cores: | 8 |
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Other/Data Bus Width (bits): | 64 |
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Other/Maximum Speed (MHz): | 1800 |
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Other/Multiple Accumulate: | No |
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Other/Minimum Operating Supply Voltage (V): | 0.65 |
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Other/Maximum Operating Supply Voltage (V): | 1.3 |
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Other/Counting: | Surface Mount |
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Other/Package Length (mm): | 52.5 |
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Other/Package Width (mm): | 45 |
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Other/PCB changed: | 2011 |
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Other/Standard Package Name: | LGA |
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Other/Supplier Packages: | FCLGA |
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Other/Pin Count: | 2011 |
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Other/Lead Shapes: | No Lead |
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Compliant with standards/RoHS standards: | RoHS Compliant |
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| Model | Brand | Similarity | Encapsulation | Introduction | Data manual |
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