Encapsulation parameters/Encapsulation: | SOIC |
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Dimensions/Packaging: | SOIC |
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Other/Product Lifecycle: | Unknown |
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Compliant with standards/RoHS standards: | Non-Compliant |
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Compliant with standards/lead standards: | Lead Free |
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| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
TP3067WM/NOPB
|
TI | 功能相似 | SOIC-20 |
TEXAS INSTRUMENTS TP3067WM/NOPB 音频编解码器, 串行接口, PCM, 1, 1, -25 °C, 125 °C, 256 kSPS
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