70247-5002 In Stock|PDF|Datasheet|Price|Agent[70247-5002 Alternative|Silk Screen|Technology|Solution Development]-ICGOODFIND

Warm reminder: The pictures are for reference only. The actual product may vary

pk Collection Purchase of mobile phones

Model 70247-5002

Description Conn Shrouded Header HDR 50POS 2.54mm Solder RA Thru-Hole Tray

Brand: Molex

Packaging Through Hole

Delivery time

Packaging method Tray

Standard packaging quantity 1

20+:

$ 0.0000

50+:

$ 0.0000

100+:

$ 0.0000

300+:

$ 0.0000

500+:

$ 0.0000

1000+:

$ 0.0000

5000+:

$ 0.0000

10000+:

$ 0.0000

Price	$ 0.0000	$ 0.0000	$ 0.0000	$ 0.0000	$ 0.0000
Start batch production	20+	50+	100+	300+	500+

Add to Cart Buy now

Welcome to use ICGOODFIND AI Assistant

Chip AI consultant

Download related files

Technical parameters/number of contacts:	50
Technical parameters/polarity:	Male
Technical parameters/Contact electroplating:	Gold
Technical parameters/number of rows:	2
Technical parameters/hot wire testing standards:	Non-Compliant
Technical parameters/halogen-free state:	Not Low Halogen
Technical parameters/direction:	Right Angle
Technical parameters/number of circuits:	50
Technical parameters/number of pins:	50
Encapsulation parameters/installation method:	Through Hole
Packaging parameters/pin spacing:	2.54 mm
Dimensions/Length:	71.1 mm
Dimensions/Width:	9.27 mm
Dimensions/Height:	8.89 mm
Dimensions/Pin Spacing:	2.54 mm
Physical parameters/shell color:	Black
Physical parameters/color:	Black
Physical parameters/contact material:	Phosphor Bronze
Physical parameters/shell material:	Plastic
Other/Product Lifecycle:	Obsolete
Other/Packaging Methods:	Tray
Other/Manufacturing Applications:	Medical, Lighting, Telecommunications, Automotive, General Motors
Compliant with standards/RoHS standards:	Non-Compliant
Compliant with standards/lead standards:	Contains Lead

Alternative material

	Model	Brand	Similarity	Encapsulation	Introduction	Data manual
	70247-5052	Molex	完全替代		2.54毫米（ .100“ ）间距C- Grid®头，双排，超薄，直角， Shrouded50电路， 0.76μm （ 30μ ”），金（Au ）选择性电镀，锡（Sn ） PC端脚镀层 2.54mm (.100") Pitch C-Grid® Header, Dual Row, Low Profile, Right Angle, Shrouded50 Circuits, 0.76μm (30μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating	PDF