Chip AI consultant
Encapsulation parameters/Encapsulation: | LFBGA-520 |
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Dimensions/Packaging: | LFBGA-520 |
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Physical parameters/operating temperature: | 0℃ ~ 70℃ |
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Other/Series: | - |
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Other/Packaging: | Tray |
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Other/Package Case: | 520-LFBGA |
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Other operating temperatures: | 0°C ~ 70°C (TA) |
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Other Supplier Device Packages: | 520-HL-PBGA (40x40) |
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Other/Voltage-I-O: | 3.3V |
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Other/Speed: | 166MHz |
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Other/Core Processor: | StrongARM |
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Other/Number of Cores Bus Wideth: | 1 Core, 32-Bit |
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Other/Co Processes DSP: | Data; Microengine |
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Other/RAM Controllers: | SDRAM |
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Other/Graphics Acceleration: | No |
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Other/Display -& -Interface-Controllers： | - |
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Other/Ethernet: | - |
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Other/SATA: | - |
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Other/USD: | - |
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Other/Security Features: | - |
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| Model | Brand | Similarity | Encapsulation | Introduction | Data manual |
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