Technical parameters/gain: | 18 dB |
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Technical parameters/testing frequency: | 18 GHz |
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Encapsulation parameters/Encapsulation: | DIE (5.7 mm x 4. 3 mm) / Wafer |
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Dimensions/Packaging: | DIE (5.7 mm x 4. 3 mm) / Wafer |
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Other/Product Lifecycle: | Obsolete |
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Other/Packaging Methods: | Pack |
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Compliant with standards/RoHS standards: | RoHS Compliant |
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| Model | Brand | Similarity | Encapsulation | Introduction | Data manual |
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