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Model VS-HFA08TB60-N3
Description HEXFRED® 超快恢复整流器，Vishay Semiconductor Vishay HEXFRED® 系列产品是超快速恢复整流器，包含超快平面技术和基于专利肖特基挡板的内部结构，可在任何 diF/dt 条件下进行软和快速恢复操作。 这些特性意味着 HEXFRED® 产品非常适合用作用于 IGBT 和 MOSFET 的配套微二极管。 ### 特点 超快恢复时间 超软恢复 极低 IRRM 极低 Qrr 减少射频干扰 (RFI) 和电磁干扰 (EMI) 降低二极管和开关晶体管中的功耗 减少减震 ### 二极管和整流器，Vishay Semiconductor
Product QR code
Brand: VISHAY
Packaging TO-220
Delivery time
Packaging method Tube
Standard packaging quantity 1
3.02  yuan 3.02yuan
5+:
$ 4.0770
25+:
$ 3.7750
50+:
$ 3.5636
100+:
$ 3.4730
500+:
$ 3.4126
2500+:
$ 3.3371
5000+:
$ 3.3069
10000+:
$ 3.2616
Quantity
5+
25+
50+
100+
500+
Price
$4.0770
$3.7750
$3.5636
$3.4730
$3.4126
Price $ 4.0770 $ 3.7750 $ 3.5636 $ 3.4730 $ 3.4126
Start batch production 5+ 25+ 50+ 100+ 500+
Check the distribution price
  • Freight charges：   In stock Freight rate：$13.00
  • Quantity： Inventory(7976) Minimum order quantity(5)
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Technical parameters/forward voltage:

1.62 V

 

Technical parameters/reverse recovery time:

55 ns

 

Technical parameters/Maximum reverse voltage (Vrrm):

1.6 kV

 

Technical parameters/forward current:

400 A

 

Technical parameters/Maximum forward surge current (Ifsm):

60 A

 

Technical parameters/maximum reverse leakage current (Ir):

15 mA

 

Technical parameters/forward voltage (Max):

2.1 V

 

Technical parameters/forward current (Max):

8 A

 

Technical parameters/operating temperature (Max):

150 ℃

 

Technical parameters/operating temperature (Min):

-55 ℃

 

Technical parameters/dissipated power (Max):

36000 mW

 

Encapsulation parameters/installation method:

Through Hole

 

Package parameters/number of pins:

2

 

Encapsulation parameters/Encapsulation:

TO-220

 

Dimensions/Length:

10.54 mm

 

Dimensions/Width:

4.57 mm

 

Dimensions/Height:

8.76 mm

 

Dimensions/Packaging:

TO-220

 

Other/Packaging Methods:

Tube

 

Compliant with standards/RoHS standards:

RoHS Compliant

 

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