Encapsulation parameters/installation method: | Through Hole |
|
Package parameters/number of pins: | 28 |
|
Encapsulation parameters/Encapsulation: | CDIP |
|
Dimensions/Length: | 37.2 mm |
|
Dimensions/Width: | 15.2 mm |
|
Dimensions/Packaging: | CDIP |
|
Dimensions/Thickness: | 1.65 mm |
|
Other/Product Lifecycle: | Active |
|
Other/Packaging Methods: | Tube |
|
Compliant with standards/RoHS standards: | Non-Compliant |
|
Compliant with standards/lead standards: | Contains Lead |
|
Customs information/ECCN code: | 3A001 |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
IDT71256S100DB
|
Integrated Device Technology | 功能相似 | CDIP |
CMOS静态RAM 256K ( 32K ×8位) CMOS STATIC RAM 256K (32K x 8-BIT)
|
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