Encapsulation parameters/installation method: | Surface Mount |
|
Package parameters/number of pins: | 20 |
|
Encapsulation parameters/Encapsulation: | QSOP |
|
Dimensions/Length: | 8.70 mm |
|
Dimensions/Width: | 3.80 mm |
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Dimensions/Packaging: | QSOP |
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Dimensions/Thickness: | 1.47 mm |
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Other/Product Lifecycle: | Obsolete |
|
Other/Packaging Methods: | Tape & Reel (TR) |
|
Compliant with standards/lead standards: | Contains Lead |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
74FCT273ATQ
|
Integrated Device Technology | 功能相似 | QSOP |
Octal d Register
|
||
|
|
Vishay Semiconductor | 功能相似 | SSOP-20 |
Flip Flop D-Type Bus Interface Pos-Edge 1Element 20Pin QSOP
|
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