Chip AI consultant
Package parameters/number of pins: | 28 |
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Encapsulation parameters/Encapsulation: | SSOP |
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Dimensions/Packaging: | SSOP |
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Other/Product Lifecycle: | Active |
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Compliant with standards/RoHS standards: | Non-Compliant |
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| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
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Silicon Labs | 功能相似 | SSOP |
12输出缓冲器2和DDR 3 SRAM DIMMS 12 Output Buffer for 2 DDR and 3 SRAM DIMMS
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W256H
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Cypress Semiconductor | 功能相似 | SSOP-28 |
12输出缓冲器2和DDR 3 SRAM DIMMS 12 Output Buffer for 2 DDR and 3 SRAM DIMMS
|
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Cypress Semiconductor | 功能相似 | SSOP |
12输出缓冲器2和DDR 3 SRAM DIMMS 12 Output Buffer for 2 DDR and 3 SRAM DIMMS
|
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Silicon Labs | 功能相似 | SSOP |
12输出缓冲器2和DDR 3 SRAM DIMMS 12 Output Buffer for 2 DDR and 3 SRAM DIMMS
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