Encapsulation parameters/Encapsulation: | VFBGA-78 |
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Dimensions/Packaging: | VFBGA-78 |
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Other/Product Lifecycle: | Not For New Designs |
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Compliant with standards/RoHS standards: |
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Compliant with standards/lead standards: | lead-free |
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| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
W631GU8KB15I TR
|
Winbond Electronics | 功能相似 | TFBGA-78 |
1G DDR3L SDRAM 1.35V X8 667MHz I
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