Encapsulation parameters/Encapsulation: | DIP |
|
Dimensions/Packaging: | DIP |
|
Other/Product Lifecycle: | Active |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
TCM320AC54CN
|
TI | 功能相似 | DIP |
电信接口IC TCM320AC54CN PDIP-16
|
||
TP3054N
|
National Semiconductor | 功能相似 | MDIP |
电信接口IC TP3054N PDIP-16
|
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