Technical parameters/Contact electroplating: | Tin |
|
Encapsulation parameters/installation method: | Surface Mount |
|
Physical parameters/contact material: | Copper |
|
Physical parameters/insulation material: | Non-Insulated |
|
Compliant with standards/RoHS standards: | RoHS Compliant |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
CMS-TO-1425-HT
|
Multicomp | 功能相似 |
MULTICOMP CMS-TO-1425-HT 接线端子, 插片式, 公, 0.25英寸, 压接
|
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