Encapsulation parameters/Encapsulation: | DIP |
|
Dimensions/Packaging: | DIP |
|
Other/Product Lifecycle: | Obsolete |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
Intersil | 功能相似 | DIP |
TEXAS INSTRUMENTS CD74HCT11E . 芯片, 三路与门, 3输入, DIP-14
|
||
CT-1-1
|
Bourns J.W. Miller | 功能相似 | DO-214AB |
AND GATE
|
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