Encapsulation parameters/Encapsulation: | DIP |
|
Dimensions/Packaging: | DIP |
|
Other/Product Lifecycle: | Obsolete |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
5962-8986302YA
|
Integrated Device Technology | 功能相似 | DIP |
FIFO, 512X9, 65ns, Asynchronous, CMOS, 1.485 X 0.310 INCH, 0.230 INCH HIEGHT, DIP-28
|
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