Encapsulation parameters/installation method: | Surface Mount |
|
Package parameters/number of pins: | 14 |
|
Encapsulation parameters/Encapsulation: | SOIC |
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Dimensions/Packaging: | SOIC |
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Other/Product Lifecycle: | Obsolete |
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Compliant with standards/RoHS standards: | Non-Compliant |
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Compliant with standards/lead standards: | Contains Lead |
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| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
Harris | 功能相似 | DIP |
TEXAS INSTRUMENTS CD74HC30E 与非门, HC系列, 8输入, 5.2 mA, 2V至6V, DIP-14
|
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CD74HC30E
|
Intersil | 功能相似 | DIP |
TEXAS INSTRUMENTS CD74HC30E 与非门, HC系列, 8输入, 5.2 mA, 2V至6V, DIP-14
|
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