Encapsulation parameters/Encapsulation: | TSSOP |
|
Dimensions/Packaging: | TSSOP |
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Other/Product Lifecycle: | Active |
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Compliant with standards/RoHS standards: | RoHS Compliant |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
M24C01-RDW6TP
|
ST Microelectronics | 功能相似 | TSSOP-8 |
PROM 串行 I²C,STMicroelectronics 与所有 I²C 总线接口模式兼容 ### EEPROM 串行存取 - STMicroelectronics
|
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