Encapsulation parameters/installation method: | Surface Mount |
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Encapsulation parameters/Encapsulation (metric): | 1608 |
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Encapsulation parameters/Encapsulation: | 0603 |
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Dimensions/Length: | 1.6 mm |
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Dimensions/Width: | 0.8 mm |
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Dimensions/Packaging (Metric): | 1608 |
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Dimensions/Packaging: | 0603 |
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Other/Product Lifecycle: | Unknown |
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Compliant with standards/RoHS standards: | RoHS Compliant |
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| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
BKP1608HS101-T
|
Taiyo Yuden | 功能相似 | 0603 |
基于印刷技术及印刷电路基板技术的提高,实现Rdc值降低并达成消费电力降低及电池, 寿命的延长。不必接地,电路设计自由度大。
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