Encapsulation parameters/installation method: | Surface Mount |
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Encapsulation parameters/Encapsulation: | SOP |
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Dimensions/Packaging: | SOP |
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Other/Product Lifecycle: | Unknown |
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Other/Packaging Methods: | Tape & Reel (TR) |
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Compliant with standards/RoHS standards: | RoHS Compliant |
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| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
S70FL256P0XMFI001
|
Cypress Semiconductor | 功能相似 | SOIC-16 |
SPANSION S70FL256P0XMFI001 闪存, 或非, 256 Mbit, 32M x 8位, 104 MHz, SPI, SOIC, 16 引脚
|
||
S70FL256P0XMFI001
|
Spansion | 功能相似 | SOIC-16 |
SPANSION S70FL256P0XMFI001 闪存, 或非, 256 Mbit, 32M x 8位, 104 MHz, SPI, SOIC, 16 引脚
|
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