Encapsulation parameters/Encapsulation: | SOP |
|
Dimensions/Packaging: | SOP |
|
Other/Product Lifecycle: | Active |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
HM1-65642-9
|
Intersil | 功能相似 | DIP |
SRAM Chip Async Single 5V 64Kbit 8K x 8 150ns 28Pin CDIP
|
©Copyright 2013-2025 ICGOODFIND (Shenzhen) Electronics Technology Co., Ltd.
The most helpful review