Encapsulation parameters/installation method: | Surface Mount |
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Encapsulation parameters/Encapsulation: | QFN-20 |
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Dimensions/Packaging: | QFN-20 |
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Other/Product Lifecycle: | Supply in progress |
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Compliant with standards/RoHS standards: | RoHS Compliant |
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Compliant with standards/lead standards: | Lead Free |
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| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
TPS59116
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TI | 功能相似 |
全套 DDR、DDR2 和 DDR3 存储器功率解决方案、用于嵌入式计算的同步降压控制器
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