Encapsulation parameters/installation method: | Surface Mount |
|
Package parameters/number of pins: | 28 |
|
Encapsulation parameters/Encapsulation: | SOP |
|
Dimensions/Packaging: | SOP |
|
Other/Product Lifecycle: | Active |
|
Other/Packaging Methods: | Tape & Reel (TR) |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
HIP6019CB
|
Intersil | 功能相似 | SOP |
先进的双PWM和线性双电源控制 Advanced Dual PWM and Dual Linear Power Control
|
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