Encapsulation parameters/Encapsulation: | DIP |
|
Dimensions/Packaging: | DIP |
|
Other/Product Lifecycle: | Obsolete |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
PAL20R6ACJS
|
AMD | 功能相似 | DIP |
PAL 6MACROCELL 30ns 28-PLCC - PAL20R6ACJS
|
||
PAL20R6ACNS
|
AMD | 功能相似 | DIP |
OT PLD, 25ns, PAL-Type, TTL, PDIP24,
|
||
PAL20R6ACNS
|
Vantis | 功能相似 | DIP |
OT PLD, 25ns, PAL-Type, TTL, PDIP24,
|
||
TIBPAL20R6-25CNT
|
TI | 功能相似 | DIP-24 |
低功耗高性能影响é PAL电路 LOW-POWER HIGH-PERFORMANCE IMPACT E PAL CIRCUITS
|
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