Encapsulation parameters/Encapsulation: | 6LD,MDIP,OPTO,WHITE,SURFACE MOUNT FORM |
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Dimensions/Packaging: | 6LD,MDIP,OPTO,WHITE,SURFACE MOUNT FORM |
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Other/Product Lifecycle: | Unknown |
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Compliant with standards/RoHS standards: | RoHS Compliant |
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| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
4N37SM
|
ISOCOM Components | 功能相似 | DIP |
Fairchild Semiconductor ### 光耦合器,Fairchild Semiconductor
|
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