Package parameters/number of pins: | 119 |
|
Encapsulation parameters/Encapsulation: | BGA |
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Dimensions/Packaging: | BGA |
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Physical parameters/operating temperature: | 0℃ ~ 70℃ |
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Other/Product Lifecycle: | Active |
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Other/Packaging Methods: | Tray |
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Compliant with standards/RoHS standards: | RoHS Compliant |
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| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
GS78116AGB-12
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GSI | 功能相似 | FBGA |
Standard SRAM, 512KX16, 12ns, CMOS, PBGA119, 14 X 22MM, 1.27MM PITCH, ROHS COMPLIANT, PLASTIC, FPBGA-119
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