Technical parameters/Contact electroplating: | Gold, Gold over Nickel |
|
Technical parameters/Insulation resistance: | 1.00 GΩ |
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Technical parameters/Contact resistance: | 6.00 mΩ |
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Technical parameters/number of plug and unplug cycles: | 500 |
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Encapsulation parameters/installation method: | Panel |
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Physical parameters/contact material: | Brass |
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Physical parameters/insulation material: | Teflon |
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Compliant with standards/RoHS standards: | Non-Compliant |
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Compliant with the REACH SVHC standard: | No SVHC |
|
Compliant with standards/military grade: | Yes |
|
Compliant with standard/REACH SVHC version: | 2015/12/17 |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
1-1337479-0
|
Tyco Electronics | 功能相似 |
TE CONNECTIVITY / GREENPAR 1-1337479-0 射频/同轴连接器, SMB同轴, 直型插座, 焊接, 50 ohm, RG174, RG188A, RG316, 黄铜
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|||
1-1337479-0
|
TE Connectivity | 功能相似 |
TE CONNECTIVITY / GREENPAR 1-1337479-0 射频/同轴连接器, SMB同轴, 直型插座, 焊接, 50 ohm, RG174, RG188A, RG316, 黄铜
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24-10-1-TGG
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Multicomp | 功能相似 |
MULTICOMP 24-10-1-TGG 射频/同轴连接器, SMB同轴, 直型隔板安装插座, 50 ohm, 铍铜
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