STMicroelectronics CFO: 80% of AI Business Revenue in 2027 to Come from Optical Chips, Optical Interconnection to Usher in Boom

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Driven by AI computing infrastructure construction, the value of optical chips and high-speed optical interconnection keeps rising. Lorenzo Grandi, CFO of STMicroelectronics, disclosed the company’s AI business revenue structure at an industry conference: STMicroelectronics targets over $2 billion in AI data center related revenue in 2027, around 80% of which will come from optical chips for fiber connection, and the remaining 20% from server cooling and power conversion chips.

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The company also mentioned that optical connection business is the main growth engine in the short term. Server power business remains small in scale for now and is expected to deliver notable revenue only after 2028. It means STMicroelectronics will focus its AI business on optical interconnection for at least the next two years.

Current training and inference of large AI models require extremely high data transmission bandwidth. Optical modules and optical chips are key hardware for high-speed data interaction between computing clusters. The surging demand for high-speed optical chips has boosted the prosperity of the whole upstream and downstream industrial chain. Not only overseas giants increase investment in R&D, but also the domestic optical chip industrial chain embraces rapid development opportunities.

For equipment manufacturers, selection and stock preparation of optical communication chips and server power devices bring heavier pressure. Sorting out BOM in advance and reserving alternative models and tracking original manufacturer capacity dynamics are critical to guarantee stable project delivery. ICGOODFIND covers massive models including optical communication chips and power management ICs, supporting component inquiry and one-click BOM kitting to help enterprises cope with fluctuations in the electronic component supply chain.

STMicroelectronics, optical chips, AI data center, high-speed optical interconnection, optical modules, server chips, component procurement, BOM kitting, ICGOODFIND

Disclaimer: This article is compiled from public industry information for reference only, and does not constitute procurement or investment advice.

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