At the 2026 World AI Conference, Enflame and Xianfeng Technology unveiled China’s first glass-substrate CoPoS advanced packaging sample for AI compute chips – marking the first time Enflame’s self-developed high-end accelerator has been paired with a domestic CoPoS solution in a complete system.
The packaging flow integrates multiple localized processes and materials, including: glass substrate base, physical vapor deposition (PVD), panel-level photolithography, precision electroplating, chemical etching, RDL fabrication, slit coating of dielectric layers, micron-precision die attach, low-stress molding for warpage control, and final grinding/dicing.
From ICgoodFind: Glass substrates + CoPoS = a homegrown packaging milestone. Moving from sample to volume is the next hurdle, but this demo proves the domestic AI packaging chain is starting to close the loop.
