LG Electronics has officially launched an ASIC design service business, with its first commercial chip – a 6nm robot vacuum SoC developed for a domestic Korean client – now taped out at TSMC. The chip will be bought back by LG and deployed in its own vacuum products.
LG sold its wafer fabrication division back in 1999 and has since operated as a fabless house, developing in-house SoCs exclusively for its home appliances and smart devices. This new external design service leverages the same TSMC partnership, extending LG's chip capabilities to third-party customers.
Offering design services monetizes LG's existing R&D talent and IP portfolio, while securing more stable advanced-node capacity through its long-standing relationship with TSMC. The company has already built a complete IP library down to 6nm, with a clear roadmap to extend its in-house design capability to 3nm by 2029.
ICgoodFind Takeaway:
LG is turning its internal chip team into a profit center. For mid-tier appliance and robotics makers, this opens a new foundry-adjacent design option without committing to a full ASIC team – all backed by TSMC's process stability.
