As FPGAs mark their 40th anniversary in 2025, these flexible, high-performance chips are becoming vital to intelligent transformation. The global FPGA market is projected to grow from $10.08 billion in 2025 to $16.23 billion by 2030, at a CAGR of 10.0%, with China accounting for 68% of global demand. Seizing this opportunity, Gowin Semiconductor has emerged as a domestic leader through proprietary IP innovation, overcoming longstanding technical barriers.
High-Speed Interface Breakthroughs
High-speed connectivity defines FPGA competitiveness. Gowin achieved a milestone by independently developing and mass-producing MIPI C-PHY interfaces and IP. Its Chenxi V series integrates 2.5Gsps MIPI C-PHY hard cores with total bandwidth up to 17.1Gbps, balancing high speed with low power and strong anti-interference capabilities. This makes it ideal for bandwidth-intensive applications like HD video and automotive imaging.
Moreover, Gowin introduced high-speed SerDes interfaces to small-scale FPGAs. Its self-developed 12.5Gbps SerDes supports protocols like DP, HDMI, and USB 3.2, breaking the convention that high-speed interfaces are reserved for premium FPGAs. This enables cost-effective, low-latency solutions for edge AI and industrial video capture.
High Efficiency in Compact Designs
Addressing demands for small size, low power, and high performance, Gowin optimized its architecture and adopted advanced processes. The LittleBee GW1NZ series achieves a static power consumption as low as 28µW, excelling in always-on scenarios. High integration further enables rich functionality in compact packages, serving power-sensitive applications like wearables and consumer electronics.
Gowin has also established a fully domestic supply chain, ensuring end-to-end control from design to testing. This enhances both delivery stability and cost efficiency for customers.
Leadership in Automotive-Grade FPGAs
The automotive sector represents the fastest-growing FPGA segment. Since entering this field in 2019, Gowin has expanded its automotive-grade offerings across the Chenxi and LittleBee series, shipping over 6 million units as of July 2025 with a failure rate in the single-digit PPM range. These AEC-Q100 certified products are deployed by leading EV makers in core functions like powertrain control and LiDAR systems.
Through deep collaboration with OEMs and Tier 1 suppliers, Gowin is building an open ecosystem for automotive FPGAs, strengthening its position in the electric and intelligent vehicle revolution.
ICgoodFind :Gowin’s proprietary IP and automotive breakthroughs set a new benchmark for domestic FPGAs, accelerating China’s semiconductor self-reliance.
