Toshiba Electronic Devices & Storage Corporation has terminated a technology cooperation agreement with Chinese silicon carbide (SiC) wafer supplier TANKEBLUE, just over a month after it was signed. The memorandum of understanding, aimed at improving semiconductor quality and ensuring a stable wafer supply through technical collaboration, was ended by "mutual discussion."
Sources indicate that the sensitive nature of semiconductors as a key economic security asset was a central reason for the termination, with any collaboration extending beyond simple procurement requiring heightened caution. Notably, Toshiba will continue to purchase wafers from TANKEBLUE, halting only the technology-sharing aspect of the relationship.
The move follows increased scrutiny on international partnerships in Japan's strategic sectors. The termination likely stems from a reassessment of economic security and technology leakage risks, underscored by Japan's recently strengthened foreign exchange law.
ICgoodFind : The end of this tech pact, while procurement continues, highlights the delicate balance between supply chain stability and security concerns in global power semiconductor collaboration.
