On September 18, Huawei made another major move in the semiconductor industry by unveiling its highly anticipated Kunpeng processor roadmap for general-purpose computing, drawing significant attention across the sector.
The roadmap begins with the Kunpeng 920, launched in Q1 2024. This chip features 64 cores, supports 80C/160T processing, and incorporates HCCS technology, providing solid support for data-intensive applications.
The Kunpeng 950 is set to debut in Q4 2026. It will offer two powerful configurations: 96C/192T and 192C/384T, support general computing super-nodes, and feature a dual-threaded Lingxi core, expected to deliver a major performance leap in general computing.
Looking ahead to Q1 2028, Huawei plans to release the Kunpeng 960. The high-performance variant (96C/192T) will target AI hosting and databases with a projected 50%+ single-core performance boost. The high-density version (≥256C/512T) will focus on virtualization, containers, big data, and data warehouses, meeting demands for large-scale data processing and complex computations.
ICgoodFind Summary: Huawei’s detailed Kunpeng roadmap demonstrates its long-term commitment to general-purpose computing, poised to reshape the industry and create new opportunities across the ecosystem.
