Sep 12 - A key breakthrough in semiconductor memory: SK Hynix officially announced the successful development of AI-focused ultra-high-performance HBM4 and built the world’s first HBM4 mass production system—giving strong impetus to AI industry growth.
“Developing HBM4 lays a solid foundation for the new AI era,” SK Hynix noted. “Our world-first HBM4 mass production system also confirms our leadership in global AI memory technology.”
High-Bandwidth Memory (HBM) boosts data speed via vertically connected DRAMs; HBM4 is its 6th-gen iteration. Per SK Hynix, HBM4 has 2,048 data channels (doubling the previous gen), doubling bandwidth while improving energy efficiency by over 40%—achieving top-tier speed and efficiency.
SK Hynix predicts HBM4 will boost AI service performance by up to 69% in customer systems, solving data bottlenecks and cutting data center power costs. Notably, it runs at over 10Gbps, far exceeding JEDEC’s 8Gbps standard.
For HBM4 development, SK Hynix used its market-recognized self-developed MR-MUF tech plus 5th-gen 10nm-class (1b) DRAM process, greatly reducing mass production risks.
Cho Joo-hwan (SK Hynix HBM Development Head) said: “HBM4 is an industry milestone. We’ll quickly deliver high-performance, energy-efficient products to secure AI memory market advantages and speed up launches.”
ICgoodFind Summary: SK Hynix’s HBM4 mass production is set to enhance AI computing power, invigorate the AI ecosystem, and likely lead new directions in memory tech.
